|
|
Cistelaier
Cistelaier
was established in 1998 by the merger of two Italian companies operating in the
printed circuit board sector: Cistel and Laier. Today Cistelaier has two production
plants situated in Genoa and Modena and offers its customers various types of printed
circuit boards made with FR4 and high-tech materials (e.g. Polyimide, Duroid, Kapton,
Thermount), with extremely fast deliveries.
Cistelaier’s mission is:
- Offer the customers a flexible service and product engineering skills
- Share its technological and production know-how, aware of the fact that the PCB
– an ever more active and integrated element – is a strategic electronic component
- Continuously invest in resources, in order to assure customers that they will always
be on the frontier of technological development
- Work side by side with the customers in co-design projects, to support them in dealing
with the growing complexity of electronics.
|
|
|
Synapto
Synapto,
set up in Catania in 2004, is a research and prototyping centre in the field of
System-in-Package (SiP) devices and technologies, i.e. the integration processes
and techniques for electronic devices and systems as far as package and/or printed
circuits are concerned. Synapto’s goal is the development of new technologies, analysis
and characterisation methods, as well as the design strategies aimed at SiP application
development, also suggesting them as a feasible and effective solution for electronic
system integration. Implementing SiP technologies in the development of an electronic
system allows us to integrate, in terms of package/PCB, active and passive electronic
devices, integrated circuits, passive embedded components, antennas, sensors, etc.,
in a highly flexible manner.
The company has developed technologies for using and combining special materials
for high-frequency/high-speed applications and for magnetic sensors.
Synapto has a full know-how in multi-layer PCB design, passive embedded components,
RF system design, numerical analysis methods, simulation and CAD/CAM, concurrent
design methods for electronic applications and advanced characterisation techniques
and instruments.
|
|